Published 1991 | Version v1
Book

The effect of heat treatments on the microstructure and electrical properties of Al/TiW/polycrystalline Si contacts

  • 1. Technion-Israel Inst. of Tech., Haifa (Israel). Dept. of Materials Engineering

Description

This paper reports on the effect of heat treatments on the microstructure, composition and electrical properties of the Al/TiW/ Polycrystalline Si system studied systematically for the first time. It was found that Al and Si diffuse through the grain boundaries of the TiW layer at 400 degrees C. Subsequently, Si accumulates at the Al/TiW interface while Al diffuses into the polycrystalline Si. TiSi, TiSi2, Al3Ti, and WAl12 are formed only at the Al/TiW interface as a result of the heat-treatments for 30 min at temperatures between 450 and 500 degrees C. The sheet resistance, measured on the surface of the Al film, is constant up to 350 degrees C and then increases with the heat treatment temperature at all times. The I-V curves are characteristic to Schottky diodes

Additional details

Publishing Information

Publisher
Materials Research Society.
Imprint Place
Pittsburgh, PA (United States)
ISBN
1-55899-094-1
Imprint Title
Evolution of thin-film and surface microstructure
Imprint Pagination
731 p.
Journal Page Range
p. 707-712.

Conference

Title
Fall meeting of the Materials Research Society (MRS).
Dates
24 Nov - 1 Dec 1990.
Place
Boston, MA (United States).

Optional Information

Secondary number(s)
CONF-901105--.