Novel 700 V high-voltage SOI LDMOS structure with folded drift region

A new high-voltage LDMOS with folded drift region (FDR LDMOS) is proposed. The drift region is folded by introducing the interdigital oxide layer in the Siactive layer, the result of which is that the effective length of the drift region is increased significantly. The breakdown characteristic has been improved by the shielding effect of the electric field from the holes accumulated in the surface of the device and the buried oxide layer. The numerical results indicate that the breakdown voltage of 700 V is obtained in the proposed device in comparison to 300 V of conventional LDMOS, while maintaining low on-resistance. (semiconductor devices)