Disentangling superconductor and dielectric microwave losses in submicrometer / interconnects using a multimode microstrip resonator
Creators
- 1. Northrop Grumman Corporation, Baltimore, Maryland 21240, USA
- 2. Department of Materials Science and Engineering, University of Maryland, College Park, Maryland 20742, USA
- 3. Quantum Materials Center, Physics Department, University of Maryland, College Park, Maryland 20742, USA
Description
An understanding of the origins of power loss in superconducting interconnects is essential for the energy efficiency and scalability of superconducting digital logic. At microwave frequencies, power dissipates in both the superconducting wires and the dielectric and these losses can be of comparable magnitude. We describe an approach to accurately disentangle such losses by exploiting their frequency dependence in a multimode transmission-line resonator. This is supported by the concept of a resonator geometric factor extracted from the Ansys High Frequency Structure Simulator (hfss), a commercial three-dimensional finite-element method (FEM) that we adopt for solving a superconductor interior. Using the technique, we have optimized a planarized fabrication process of reciprocal quantum logic (RQL) for the minimum interconnect loss at 4.2 K and gigahertz frequencies. The microstrip interconnects are composed of niobium () insulated by silicon dioxide () made from a tetraethoxysilane (TEOS) precursor. Two process generations use damascene fabrication and the third one uses Cloisonné fabrication. For all three, exhibits a dielectric loss tangent , independent of the wire width over 0.25–4 . The intrinsic microwave resistance of varies with both the process and the wire width. For damascene fabrication, scanning transmission electron microscopy (STEM) and energy-dispersive x-ray spectroscopy (EDS) reveal that plasma oxidation and grain-growth orientation increase above the Bardeen-Cooper-Schrieffer (BCS) resistance at 10 GHz. For Cloisonné fabrication, we demonstrate down to wire width, which is below and arguably the lowest microwave resistance reported for at 4.2 K.
Additional details
Identifiers
- DOI
- 10.1103/PhysRevApplied.21.024056;
- arXiv
- arXiv:2303.10685;
- Crossref Funder ID
- 10.13039/100000001; 10.13039/100000015; 10.13039/100006208; 10.13039/100011038; 10.13039/100011039; 10.13039/100000183;
Publishing Information
- Journal Title
- Physical Review Applied
- Journal Volume
- 21
- Journal Issue
- 2
- Journal Page Range
- 20 pgs.
- ISSN
- 2331-7019
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ENERGY EFFICIENCY; FABRICATION; FINITE ELEMENT METHOD; FREQUENCY DEPENDENCE; MICROWAVE RADIATION; NIOBIUM; OXIDATION; PRECURSOR; RESONATORS; SILICA; SILICON OXIDES; SUPERCONDUCTING WIRES; TRANSMISSION; TRANSMISSION ELECTRON MICROSCOPY; WIRES; X-RAY SPECTROSCOPY
- Descriptors DEC
- CALCULATION METHODS; CHALCOGENIDES; CHEMICAL REACTIONS; EFFICIENCY; ELECTROMAGNETIC RADIATION; ELECTRON MICROSCOPY; ELECTRONIC EQUIPMENT; ELEMENTS; EQUIPMENT; MATHEMATICAL SOLUTIONS; METALS; MICROSCOPY; MINERALS; NUMERICAL SOLUTION; OXIDE MINERALS; OXIDES; OXYGEN COMPOUNDS; RADIATIONS; REFRACTORY METALS; SILICON COMPOUNDS; SPECTROSCOPY; TRANSITION ELEMENTS; WIRES
Optional Information
- Copyright
- © 2024 American Physical Society
- Contract/Grant/Project number
- NSF DMR-2004386; #DESC0017931; W911NF-14-C-0116
- Notes
- Contact Email: cougar.garcia@ngc.com; Present address: IMEC-USA, Kissimmee, Florida 34744, USA; Record automatically processed
- Funding organization
- National Science Foundation; U.S. Department of Energy; High Energy Physics; Office of the Director of National Intelligence (ODNI); Intelligence Advanced Research Projects Activity (IARPA); U.S. Army Research Office (ARO)