Published June 2006
| Version v1
Journal article
Studying surfaces and thin films using Moessbauer spectroscopy
Creators
- 1. McGill University, Center for the Physics of Materials, Department of Physics (Canada)
Description
Using a series of bi-layer samples, we show how Conversion Electron Moessbauer Spectroscopy (CEMS) and X-ray Backscatter Moessbauer Spectroscopy (XBS) can be done with the same experimental set up. The penetration depths of the K and L conversion electrons are measured as 51(6) and 330(240) nm, respectively, with relative contributions of 88(9) and 12(9)%. The penetration depth of the Fe-Kα X-ray signal is determined to be 3.6(2) μm. As a demonstration we show data on surface damage effects in electropolished TRIP steels, and by comparing CEMS and XBS Moessbauer patterns we estimate the thickness of a damaged layer (created by sanding) to be 550(50) nm.
Additional details
Identifiers
Publishing Information
- Journal Title
- Hyperfine Interactions
- Journal Volume
- 170
- Journal Issue
- 1-3
- Journal Page Range
- p. 131-143
- ISSN
- 0304-3843
- CODEN
- HYINDN
Conference
- Title
- 4. Nassau Moessbauer symposium
- Dates
- 13-14 Jan 2006
- Place
- Garden City, NY (United States)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 43029763
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- BACKSCATTERING; ELECTRONS; K CONVERSION; L CONVERSION; LAYERS; MOESSBAUER EFFECT; PENETRATION DEPTH; STEELS; SURFACES; THICKNESS; THIN FILMS; X RADIATION
- Descriptors DEC
- ALLOYS; CARBON ADDITIONS; CONVERSION; DECAY; DIMENSIONS; ELECTROMAGNETIC RADIATION; ELEMENTARY PARTICLES; FERMIONS; FILMS; INTERNAL CONVERSION; IONIZING RADIATIONS; IRON ALLOYS; IRON BASE ALLOYS; LEPTONS; NUCLEAR DECAY; RADIATIONS; SCATTERING; TRANSITION ELEMENT ALLOYS
Optional Information
- Copyright
- Copyright (c) 2007 Springer Science+Business Media, Inc.