Effect of Zinc Additions on Sn-0.7Cu-0.05Ni Lead-Free Solder Alloy

This study focuses on the effect of zinc additions on Sn-0.7Cu-0.05Ni lead free solder alloy. Micro-alloying with additions of 0.5, 1.0 and 1.5 wt.% of zinc (Zn) was developed by using conventional casting method. Samples were analyzed using optical microscope (OM), scanning electron microscope (SEM), X-ray diffraction (XRD), differential scanning calorimetry (DSC) and vickers hardness testing. Analysis were carried out to investigate the microstructure, thickness of intermetallic compounds (IMCs), wettability, phase formation, thermal properties and hardness of Sn-0.7Cu-0.05Ni solder alloys with additions of different Zn percentage. From this study, it is found that different composition of Zn affected the physical and mechanical properties of Sn-0.7Cu-0.05Ni solder alloys. Results shows that increasing Zn could increase the wettability, reduce the melting point and slightly reduce the ultimate tensile strength of the solder alloy. (paper)