Published May 2018 | Version v1
Journal article

Structure and electrical properties of sputtered Cu2−xTe films (0 ≤ x ≤ 1)

  • 1. Centro de Investigación y de Estudios Avanzados del I.P.N., Unidad Querétaro, Libramiento Norponiente No. 2000, Frac. Real de Juriquilla, Querétaro, Qro. C.P. 76230 (Mexico)
  • 2. Centro de Investigaciones en Ciencias de la Tierra y Materiales, Universidad Autónoma del Estado de Hidalgo, UAEH, Ciudad del Conocimiento, C.P. 42184 Mineral de la Reforma, Hidalgo (Mexico)

Description

Highlights: • Cu2−xTe films sputtered from targets made of Cu and Te powders for the first time. • Dominant crystalline phases were obtained depending on growth parameters. • Simple and robust method for Cu2−xTe film growth and phase control is provided. • Electrical properties vary significantly depending on Cu2−xTe crystalline phase. - Abstract: Radio frequency sputtering was used to grow copper telluride films from targets fabricated by cold pressing mixtures of copper and tellurium powders. Through this method, Cu2−xTe targets and films with 0 ≤ x ≤ 1 in nominal composition were elaborated. X-ray diffraction showed that the films comprised mixtures of various copper telluride phases. However, dominant phases resulted, in most cases, depending on the target nominal composition and on the substrate temperature. The temperatures employed varied between room temperature and 350 °C. In the specific cases of growths at 100 °C from the target with nominal composition [Cu]/[Te] = 1, and at 200 °C from the [Cu]/[Te] = 1.5 target, nearly single phases of CuTe and Cu7Te5 were obtained, respectively. Through Hall effect measurements the resistivity, free carrier density and mobility were determined as a function of target composition and substrate temperature.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2018.03.006

Additional details

Identifiers

DOI
10.1016/j.tsf.2018.03.006;
PII
S0040609018301433;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
653
Journal Page Range
p. 143-150
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.