Published August 1980 | Version v1
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Decay heat removal under boiling condition in a pin-bundle geometry

  • 1. Power Reactor and Nuclear Fuel Development Corp., Oarai, Ibaraki (Japan). Oarai Engineering Center

Description

Decay heat removal capability under boiling condition was investigated using an electrically heated 37-pin bundle test section. The flow was driven by natural circulation force of the out-of-pile sodium loop SIENA in O-arai Engineering Center, PNC. As the heater power was increased, the two-phase flow regime changed from bubbly flow to slug flow and then to annular or annular mist flow. In 15 runs, dry-out was not observed in the average exit quality region of less than 0.5. The results indicated the existance of a large ''boiling window'' for low flow rate and low power conditions. (author)

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Additional details

Publishing Information

Imprint Pagination
10 p.
Report number
PNC-N--941-80-130

Optional Information

Notes
Paper presented to the 9th Liquid Metal Boiling Working Group Meeting, June 4 - 6, 1980, Rome, Italy.