Published May 26, 2006 | Version v1
Journal article

Influences of oxide material on high density plasma production using capacitively coupled discharge

  • 1. Department of Electrical and Electronic Engineering, Saga University, 1 Honjo-machi, Saga 840-8502 (Japan)

Description

Production of capacitively coupled high density plasma with electron density of 101-1011 cm-3 was realized by the addition of secondary electrons emission from electrode using some oxide materials. The breakdown voltage has also been investigated at various oxide materials such as copper oxide (CuO), magnesium oxide(MgO), titanium oxide (TiO2) and strontium titanium oxide (SrTiO3). The breakdown voltage for MgO and SrTiO3 materials was lower than that for CuO and TiO2 materials. The plasma density for MgO and SrTiO3 materials was found to increase drastically with increasing applied voltage V RF, while for CuO and TiO2 materials, it increased to be roughly proportional to V RF

Additional details

Identifiers

DOI
10.1016/j.tsf.2005.08.071;
PII
S0040-6090(05)01294-0;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
506-507
Journal Page Range
p. 545-549
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
Joint meeting of 7. APCPST (Asia Pacific conference on plasma science and technology) and 17. SPSM (symposium on plasma science for materials)
Dates
29 Jun - 2 Jul 2004
Place
Fukuoka (Japan)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38004649
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
BREAKDOWN; COPPER OXIDES; ELECTRIC POTENTIAL; ELECTRON DENSITY; ELECTRON EMISSION; MAGNESIUM OXIDES; PLASMA; PLASMA DENSITY; STRONTIUM TITANATES; TITANIUM OXIDES
Descriptors DEC
ALKALINE EARTH METAL COMPOUNDS; CHALCOGENIDES; COPPER COMPOUNDS; EMISSION; MAGNESIUM COMPOUNDS; OXIDES; OXYGEN COMPOUNDS; STRONTIUM COMPOUNDS; TITANATES; TITANIUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.