Activated sintering of nickel-doped tungsten: Approach by grain boundary structural transition
Description
The addition of a small amount of Ni to a W powder has been known to enhance the densification of a compact significantly especially in the temperature range of 1,000 approximately 1,200 C. It is highly probable that the abrupt change in the sintering behavior by the addition of a small amount of the second element might be related to a grain boundary structural transition. In relation to this possibility, Lee et al. studied the temperature dependence of the grain boundary diffusivity. They observed that the diffusivity increased abruptly above approximately 1,100 C for Ni-doped W. This result is similar to the previous report by Schintlmeister and Richter on the discontinuous increase in grain boundary diffusivity above approximately 1,200 C in Ni-doped W. Such an abrupt change in grain boundary diffusivity was attributed to the grain boundary transition. On the other hand, the temperature for such a discontinuous change in grain boundary diffusivity coincides with the temperature for the onset of activated sintering of Ni-doped W. Therefore, there is a possibility that the discontinuous increase in the densification of W by Ni might be the result of a structural transition of the grain boundary. The purpose of this paper is to examine this possibility of an Ni-induced grain boundary transition of W grains based on microstructural observations
Additional details
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 42
- Journal Issue
- 5
- Journal Page Range
- p. 421-425
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- United States
- INIS RN
- 31026162
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- DIFFUSION; GRAIN BOUNDARIES; METALLURGICAL EFFECTS; NICKEL ADDITIONS; SCANNING ELECTRON MICROSCOPY; SINTERING; TEMPERATURE RANGE 1000-4000 K; TUNGSTEN
- Descriptors DEC
- ELECTRON MICROSCOPY; ELEMENTS; FABRICATION; METALS; MICROSCOPY; MICROSTRUCTURE; REFRACTORY METALS; TEMPERATURE RANGE; TRANSITION ELEMENTS