Published October 2008 | Version v1
Journal article Metadata-only

Novel thermoplastic bonding using a bulk metallic glass solder

Creators

  • 1. Keck Laboratory of Engineering Materials, California Institute of Technology, MC 138-78, 1200 E. California Boulevard, Pasadena, CA 91125 (United States)
  • 2. Metallurgical Engineering Department, Chulalongkorn University, Bangkok 10330 (Thailand)
  • 3. Department of Manufacturing Systems Engineering and Management, California State University Northridge, Northridge, CA 91330 (United States)
  • 4. Components Research, Intel Corporation, Chandler, AZ 85226 (United States)

Description

A novel thermoplastic bonding concept is demonstrated based on the unique rheological behavior and pattern-replicating ability of bulk metallic glass (BMG)-forming liquids. In this approach, the BMG is heated above Tg to the 'supercooled liquid' region while a small normal force is applied to the joint. This results in liquid reflow, wetting and a strong bond. Complete wetting between copper substrates and a layer of platinum-based BMG leads to an atomistically intimate void-free interface

Availability note (English)

Available from http://dx.doi.org/10.1016/j.scriptamat.2008.06.055

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2008.06.055;
PII
S1359-6462(08)00502-2;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
59
Journal Issue
8
Journal Page Range
p. 905-908
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40027698
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
BONDING; COPPER; INTERFACES; LAYERS; LIQUIDS; METALLIC GLASSES; PLATINUM; SOLDERING; THERMOPLASTICS; VOIDS
Descriptors DEC
ELEMENTS; FABRICATION; FLUIDS; JOINING; MATERIALS; METALS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; PLASTICS; PLATINUM METALS; POLYMERS; SYNTHETIC MATERIALS; TRANSITION ELEMENTS; WELDING

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.