Published July 21, 1992 | Version v1
Patent Metadata-only

Direct write with microelectronic circuit fabrication

Creators

Description

This patent describes a process for forming a pattern on a substrate by deposition of a material. It comprises depositing a suspension of colloidal particles of the material in a solvent on to a substrate by ink jet printing; evaporating the solvent, the material remaining on the substrate; laser annealing the deposited material to the substrate, the pattern being defined by the path of the laser beam; and removing excess material not annealed by the laser beam

Availability note (English)

Patent and Trademark Office, Box 9, Washington, DC 20232 (United States).

Additional details

Publishing Information

Imprint Pagination
10 p.
IPC:
Int. Cl. H01L 21/00.
IPC
Int. Cl. H01L 21/00.
Patent number
US patent document 5,132,248/A/

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
24015518
Subject category
S42: ENGINEERING; S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
BEAM OPTICS; COLLOIDS; EVAPORATION; FABRICATION; LASER-RADIATION HEATING; MATERIALS; MICROELECTRONIC CIRCUITS; SOLVENTS; SUBSTRATES
Descriptors DEC
DISPERSIONS; ELECTRONIC CIRCUITS; HEATING; PHASE TRANSFORMATIONS; PLASMA HEATING