Published 2017 | Version v1
Miscellaneous Metadata-only

Residual stresses and crack growth in microelectronic thin films

Creators

Description

The abstract and the PDF can be found in the attached link.

Availability note (English)

Available from Leoben University Library, Franz-Josef-Strasse 18, 8700 Leoben (Austria) and available from http://search.obvsg.at/primo_library/libweb/action/dlDisplay.do?vid=OBV&docId=OBV_alma71349404160003331&fn=permalink

Additional details

Identifiers

URL
http://search.obvsg.at/primo_library/libweb/action/dlDisplay.do?vid=OBV&docId=OBV_alma71349404160003331&fn=permalink;

Publishing Information

Imprint Pagination
86 p.

INIS

Country of Publication
Austria
Country of Input or Organization
Austria
INIS RN
50067894
Subject category
S36: MATERIALS SCIENCE; S42: ENGINEERING;
Resource subtype / Literary indicator
Thesis, Non-conventional Literature
Descriptors DEI
FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES; ION BEAMS; RESIDUAL STRESSES; THIN FILMS
Descriptors DEC
BEAMS; CALCULATION METHODS; FILMS; MATHEMATICAL SOLUTIONS; MECHANICS; NUMERICAL SOLUTION; STRESSES