Published April 2012 | Version v1
Journal article

Investigation of impact toughness of a Ni-based superalloy at elevated temperature

  • 1. Superalloy Division, Institute of Metal Research, Chinese Academy of Sciences, Shenyang (China)

Description

Highlights: ► The samples show highest impact toughness at 600 °C. ► The impact toughness of samples impact at 760 °C drops sharply. ► The voids nucleation and growth are fracture mechanism at elevated temperature. ► The decrease in strength of grain boundaries causes reduction in impact toughness. -- Abstract: The impact toughness of M951 alloy is investigated in temperature range between 20 °C and 800 °C. The results show that the impact toughness of samples impacted at 600 °C shows highest impact toughness value, the impact toughness value drops sharply when the samples impacted at 760 °C. In addition samples impacted at 800 °C show the higher impact toughness than that of samples impact at 760 °C. The scanning electron microscope observations show that cracks initiate at carbides particles due to high stress concentration, which leads to low impact toughness value at 20 °C. The dimples which can absorb more energy are formed during the impact at 600 °C. The samples impacted at 760 °C show lowest impact toughness. Additionally, the dimples nucleation, growth and coalescence are the major fracture mechanism at elevated temperature.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matdes.2011.11.067

Additional details

Identifiers

DOI
10.1016/j.matdes.2011.11.067;
PII
S0261-3069(11)00827-2;

Publishing Information

Journal Title
Materials and Design
Journal Volume
36
Journal Page Range
p. 699-704
ISSN
0261-3069
CODEN
MADSD2

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
45022444
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALLOYS; COALESCENCE; FRACTURES; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY
Descriptors DEC
ELECTRON MICROSCOPY; FAILURES; MICROSCOPY; MICROSTRUCTURE

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.