Published August 1997
| Version v1
Journal article
Electrochemical deposition of copper onto Pt(111) in the presence of (bi)sulfate anions
Creators
- 1. Department of Physics, University of Liverpool, Oliver Lodge Laboratory, Liverpool, L69 7ZE (United Kingdom)
- 2. Materials Sciences Division, Lawrence Berkeley National Laboratory, University of California, Berkeley, California 94720 (United States)
Description
Using in situ x-ray diffraction we have studied the underpotential deposition (UPD) of copper onto a Pt(111) electrode in sulfuric acid. Deposition occurs in a two-stage process; close to a full monolayer of Cu being preceded by a (√(3)x√(3))R30 degree structure that consists of both Cu and (bi)sulfate anions and is similar to the structure observed on the Au(111) electrode. Utilizing anomalous scattering methods we can accurately determine the Cu coverage during UPD and propose structural models based on crystal truncation rod measurements. copyright 1997 The American Physical Society
Additional details
Publishing Information
- Journal Title
- Physical Review. B, Condensed Matter
- Journal Volume
- 56
- Journal Issue
- 7
- Journal Page Range
- p. 3651-3654.
- ISSN
- 0163-1829
- CODEN
- PRBMDO
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 29008104
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- COPPER; CRYSTAL STRUCTURE; ELECTROCHEMICAL COATING; ELECTROCHEMISTRY; ELECTRODES; ELECTROLYTES; INTERFACES; PLATINUM; SULFURIC ACID; X-RAY DIFFRACTION
- Descriptors DEC
- CHEMICAL COATING; COHERENT SCATTERING; DEPOSITION; DIFFRACTION; ELEMENTS; HYDROGEN COMPOUNDS; INORGANIC ACIDS; INORGANIC COMPOUNDS; METALS; OXYGEN COMPOUNDS; PLATINUM METALS; SCATTERING; SULFUR COMPOUNDS; SURFACE COATING; TRANSITION ELEMENTS