New Method to Estimate the Permittivity of Dielectric Materials Using MSPS
Creators
- 1. Universiti Putra Malaysia (UPM), Functional Devices Laboratory, Institute of Advanced Technology (Malaysia)
- 2. Universiti Putra Malaysia (UPM), Department of Electrical and Electronic Engineering (Malaysia)
- 3. Universiti Putra Malaysia (UPM), Department of Wireless and Photonic Research Center, Computer and Communication Systems Engineering (Malaysia)
Description
A new method to estimate the relative dielectric permittivity of material's sheet is presented. In this method, a conventional microstrip patch sensor (MSPS) is utilized to resonate at 2.45 GHz. An unknown material, considered as a superstrate layer of 5 mm thickness, is located in the near-field region of the MSPS, at a distance of 5 mm above the sensor. From the changes in the MSPS's parameters, the dielectric property of the unknown material can be deduced. Based on the conformal map theory, theoretical analyses were performed, and hence, simulation analyses were done using the CST-MW software package. This proposed method was validated through measurements. From the theoretical, simulation, and measurement results, it was shown that depending on the frequency response, the relative permittivity can be estimated.
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Superconductivity and Novel Magnetism
- Journal Volume
- 30
- Journal Issue
- 12
- Journal Page Range
- p. 3577-3580
- ISSN
- 1557-1939
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 50014979
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- COMPUTER CODES; CONFORMAL MAPPING; DIELECTRIC MATERIALS; EXPERIMENT RESULTS; GHZ RANGE; LAYERS; PERMITTIVITY; SENSORS; SIMULATION; THICKNESS
- Descriptors DEC
- DIELECTRIC PROPERTIES; DIMENSIONS; ELECTRICAL PROPERTIES; FREQUENCY RANGE; MAPPING; MATERIALS; PHYSICAL PROPERTIES; TOPOLOGICAL MAPPING; TRANSFORMATIONS
Optional Information
- Copyright
- Copyright (c) 2016 Springer Science+Business Media New York
- Notes
- http://www.springer-ny.com