Vertical integration technologies for vertex detectors

This work is focused on the use of vertical integration (3D) technologies in the design of hybrid or monolithic pixel detectors in view of applications to silicon vertex trackers (SVTs) at the future high luminosity colliders. After a short introduction on the specifications of next-generation SVTs, the paper will discuss the general features of 3D microelectronic processes and the benefits they can provide to the design of pixel detectors for high energy physics experiments.