Published 1995 | Version v1
Book

Influence of demixing on SF6 arc properties

  • 1. Universite Paul Sabatier, Toulouse (France)

Description

Experimental analyses of wall stabilized SF6 arcs have shown that demixing effect changes the chemical composition of the plasma. This effect. which is due to diffusion and to the difference between the ionization potential of fluorine and that of sulphur, leads to a depletion of sulphur near the axis. So in this region, the ratio M (called the demixing factor) between the fluorine concentration (atoms + ions) and the sulphur concentration is greater than 6 (6 being the stoichiometric value). On the other hand the usual modelling of these arcs is based on the hypothesis of the stoichiometric equilibrium coupled with LTE assumption. In this communication we present first the calculation of the material functions (transport coefficients and radiation losses) of S + F plasma for different values of the M factor, and second, the calculation of the temperature in these kinds of mixture, in order to study the influence of demixing on the axis temperature of SF6 wall stabilized arcs

Additional details

Publishing Information

Publisher
Stevens Institute of Technology.
Imprint Place
Hoboken, NJ (United States)
Imprint Title
XXII International conference on phenomena in ionized gases. Contributed papers 1
Imprint Pagination
172 p.
Journal Page Range
p. 79-80.

Conference

Title
22. international conference on phenomena in ionized gases.
Dates
31 Jul - 4 Aug 1995.
Place
Hoboken, NJ (United States).

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
27052446
Subject category
S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
Resource subtype / Literary indicator
Conference
Descriptors DEI
CHEMICAL COMPOSITION; CONCENTRATION RATIO; ELECTRIC ARCS; MIXING; SULFUR FLUORIDES
Descriptors DEC
CURRENTS; ELECTRIC CURRENTS; ELECTRIC DISCHARGES; FLUORIDES; FLUORINE COMPOUNDS; HALIDES; HALOGEN COMPOUNDS; SULFUR COMPOUNDS

Optional Information

Secondary number(s)
CONF-950749--.