Published January 29, 2001 | Version v1
Journal article

Detection of organic contamination on silicon substrates: Comparison of several techniques

  • 1. CEA-Leti (Technologies Avancees), 17 Rue des Martyrs, F-38054 Grenoble Cedex 9 (France)
  • 2. EURIS, Rue de Corporat, Centr'Alp, F-38430 Moirans (France)
  • 3. STMicroelectronics, Rue Jean Monnet, F-38290 Crolles (France)

Description

Organic contamination adsorbed on 200 mm silicon wafers was characterized using various analytical techniques. Surface hydrophobicity, apparent optical thickness and electrical surface charge are used to characterize the silicon surface state. They only give information on total organic contamination. MIR-FTIR is very sensitive for detecting CH2 and CH3 contained in organics on silicon wafers. TOF-SIMS is quite sensitive and enables some of the organics to be recognized by identifying the molecule fragments. TDGC-MS is the most relevant technique to identify organic contamination on silicon wafers as extensive identification libraries exist

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
550
Journal Issue
1
Journal Page Range
p. 297-301
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
IEEE international conference on characterization and metrology for ULSI technology
Dates
26-29 Jun 2000
Place
Gaithersburg, MD (United States)

Optional Information

Notes
(c) 2001 American Institute of Physics.