The assessment of the fracture behavior in spin-on organosilicates by nanoindentation and nanoscratch tests
Creators
- 1. Korea Testing Laboratory, 516 Haeanro, Sa-dong, Sangnok-gu, Ansan-si, Gyeonggi-do, 426-901 (Korea, Republic of)
- 2. LG Chem. Ltd., Research Park, 104-1 Moonji-dong, Yuseong-gu, Daejeon, 305-380 (Korea, Republic of)
Description
Fracture behavior of the copolymers proposed as interlayer dielectric candidates is examined to find the adequate amount of bis(trimethoxysilyl)ethane to methyltrimethoxysilane that can optimize mechanical properties. In spite of the shortcoming that provides a result for comparison purpose, the indentation test becomes a good alternative to estimate cohesive and adhesive fracture strength simultaneously. The scratch test can also be used to evaluate adhesive fracture strength. The similarity between the scratch test and the chemical mechanical planarization process may offer a clue for predicting the possibility of failure during fabrication procedure. The sequence of magnitude in critical loads measured from both tests corresponds with that of fracture toughness assessed by the modified edge lift-off test.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.tsf.2008.10.141Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2008.10.141;
- PII
- S0040-6090(08)01334-5;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 517
- Journal Issue
- 11
- Journal Page Range
- p. 3216-3221
- ISSN
- 0040-6090
- CODEN
- THSFAP
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 42042836
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- ADHESIVES; COPOLYMERS; DIELECTRIC MATERIALS; FABRICATION; FRACTURE PROPERTIES; FRACTURES; ORGANIC SILICON COMPOUNDS; SPIN-ON COATINGS; TESTING
- Descriptors DEC
- COATINGS; FAILURES; MATERIALS; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC POLYMERS; POLYMERS
Optional Information
- Copyright
- Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.