Published April 2, 2009 | Version v1
Journal article

The assessment of the fracture behavior in spin-on organosilicates by nanoindentation and nanoscratch tests

  • 1. Korea Testing Laboratory, 516 Haeanro, Sa-dong, Sangnok-gu, Ansan-si, Gyeonggi-do, 426-901 (Korea, Republic of)
  • 2. LG Chem. Ltd., Research Park, 104-1 Moonji-dong, Yuseong-gu, Daejeon, 305-380 (Korea, Republic of)

Description

Fracture behavior of the copolymers proposed as interlayer dielectric candidates is examined to find the adequate amount of bis(trimethoxysilyl)ethane to methyltrimethoxysilane that can optimize mechanical properties. In spite of the shortcoming that provides a result for comparison purpose, the indentation test becomes a good alternative to estimate cohesive and adhesive fracture strength simultaneously. The scratch test can also be used to evaluate adhesive fracture strength. The similarity between the scratch test and the chemical mechanical planarization process may offer a clue for predicting the possibility of failure during fabrication procedure. The sequence of magnitude in critical loads measured from both tests corresponds with that of fracture toughness assessed by the modified edge lift-off test.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2008.10.141

Additional details

Identifiers

DOI
10.1016/j.tsf.2008.10.141;
PII
S0040-6090(08)01334-5;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
517
Journal Issue
11
Journal Page Range
p. 3216-3221
ISSN
0040-6090
CODEN
THSFAP

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
42042836
Subject category
S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
Descriptors DEI
ADHESIVES; COPOLYMERS; DIELECTRIC MATERIALS; FABRICATION; FRACTURE PROPERTIES; FRACTURES; ORGANIC SILICON COMPOUNDS; SPIN-ON COATINGS; TESTING
Descriptors DEC
COATINGS; FAILURES; MATERIALS; MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC POLYMERS; POLYMERS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.