Published October 2013 | Version v1
Journal article

Topographic design and application of hierarchical polymer surfaces replicated by microinjection compression molding

  • 1. Lab for Micro Molding and Polymer Rheology, The Key Laboratory of Polymer Processing Engineering of the Ministry of Education, South China University of Technology, Guangzhou 510640 (China)

Description

In recent years, the fast growing demand for biomimetic surfaces featuring unique wettability and functionality in various fields highlights the necessity of developing a reliable technique for mass production. In this work, hierarchical topography designs of templates were applied to prepare superhydrophobic surfaces via microinjection compression molding, comprehensively considering the feasibility of mechanical demolding and the superhydrophobicity and mechanical robustness of the molded polypropylene parts. Mimicking the wettability of a lotus leaf or rose petal, superhydrophobic surfaces were replicated. An unstable wetting state formed on the surface exhibiting the petal effect. On such a surface, the increased water pressure could cause water penetration into the micro gaps between the hierarchical asperities featuring low-roughness sidewalls and bottom surface; the resultant water membrane led to drastically increased water adhesion of the surface. Moreover, the low-adhesion superhydrophobicity of the molded surface was changed into superhydrophilicity, by means of introducing carbonyl groups via ultraviolet/ozone treatment and the subsequent water membrane preserved in microstructures via the pre-wetting process. Patterning the superhydrophilic micro channel on the superhydrophobic surface developed the surface microfluidic devices for micro-liter fluid pumping and mixing processes driven by surface tension. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/23/10/105010

Additional details

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
23
Journal Issue
10
Journal Page Range
[9 p.]
ISSN
0960-1317
CODEN
JMMIEZ