Published July 2009
| Version v1
Journal article
Yield strength in nanocrystalline Cu during high strain rate deformation
- 1. Department of Materials Science and Engineering, University of Illinois, Urbana Champaign, Urbana, IL 61801 (United States)
- 2. Chemistry, Materials, and Life Sciences Directorate, Lawrence Livermore National Laboratory, Livermore, CA 94550 (United States)
Description
Molecular dynamics simulations are used to study the yield strength of thermally annealed nanocrystalline Cu samples. For strain rates of 1 x 1010 and 1 x 109 s-1, the observed yield strength scales with the fractional number of grain boundary (GB) atoms. This observation suggests a new scaling behavior for the onset of plasticity in nanocrystalline materials, controlled not by the grain size alone, but by a combination of both grain size and degree of GB relaxation, as measured by the GB volume.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2009.03.003Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2009.03.003;
- PII
- S1359-6462(09)00180-8;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 61
- Journal Issue
- 1
- Journal Page Range
- p. 76-79
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44113290
- Subject category
- S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
- Descriptors DEI
- CRYSTALS; DEFORMATION; GRAIN BOUNDARIES; GRAIN SIZE; MOLECULAR DYNAMICS METHOD; NANOSTRUCTURES; PLASTICITY; SIMULATION; STRAIN RATE; YIELD STRENGTH
- Descriptors DEC
- CALCULATION METHODS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SIZE
Optional Information
- Copyright
- Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.