Published July 2009 | Version v1
Journal article

Yield strength in nanocrystalline Cu during high strain rate deformation

  • 1. Department of Materials Science and Engineering, University of Illinois, Urbana Champaign, Urbana, IL 61801 (United States)
  • 2. Chemistry, Materials, and Life Sciences Directorate, Lawrence Livermore National Laboratory, Livermore, CA 94550 (United States)

Description

Molecular dynamics simulations are used to study the yield strength of thermally annealed nanocrystalline Cu samples. For strain rates of 1 x 1010 and 1 x 109 s-1, the observed yield strength scales with the fractional number of grain boundary (GB) atoms. This observation suggests a new scaling behavior for the onset of plasticity in nanocrystalline materials, controlled not by the grain size alone, but by a combination of both grain size and degree of GB relaxation, as measured by the GB volume.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.scriptamat.2009.03.003

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2009.03.003;
PII
S1359-6462(09)00180-8;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
61
Journal Issue
1
Journal Page Range
p. 76-79
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
44113290
Subject category
S36: MATERIALS SCIENCE; S77: NANOSCIENCE AND NANOTECHNOLOGY;
Descriptors DEI
CRYSTALS; DEFORMATION; GRAIN BOUNDARIES; GRAIN SIZE; MOLECULAR DYNAMICS METHOD; NANOSTRUCTURES; PLASTICITY; SIMULATION; STRAIN RATE; YIELD STRENGTH
Descriptors DEC
CALCULATION METHODS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SIZE

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.