Published December 15, 1998 | Version v1
Patent Metadata-only

Load regulating expansion fixture

Creators

Description

A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils is disclosed. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located there between. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components. 1 fig

Availability note (English)

Available from Patent and Trademark Office, Box 9, Washington, DC 20232 (United States)

Additional details

Publishing Information

Imprint Pagination
[10 p.]
IPC:
Int. Cl. B23K 20/02
IPC
Int. Cl. B23K 20/02
Patent number
US patent document 5,848,746/A/

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
30031982
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
BERYLLIUM; DESIGN; SELF-WELDING; THIN FILMS; WELDING MACHINES
Descriptors DEC
ALKALINE EARTH METALS; BONDING; ELEMENTS; FABRICATION; FILMS; JOINING; METALS

Optional Information

Funding organization
USDOE, Washington, DC (United States)
Secondary number(s)
US patent application 8-586,129