Published April 1, 2006 | Version v1
Journal article Metadata-only

A silicon-based flexible tactile sensor for ubiquitous robot companion applications

Creators

  • 1. Nano Mechatronics Research Center, Korea Electronics Technology Institute, hashmark 68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do 463-816 (Korea, Republic of)
  • 2. Department of Electronics and Computer Engineering, Korea University (Korea, Republic of)
  • 3. Mass and Force Group, Korea Research Institute of Standards and Science (Korea, Republic of)

Description

We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip

Availability note (English)

Available online at http://stacks.iop.org/1742-6596/34/399/jpconf6_34_065.pdf or at the Web site for the Journal of Physics. Conference Series (Online) (ISSN 1742-6596) http://www.iop.org/

Additional details

Identifiers

URL
http://stacks.iop.org/1742-6596/34/399/jpconf6_34_065.pdf;
DOI
10.1088/1742-6596/34/1/065;

Publishing Information

Journal Title
Journal of Physics. Conference Series (Online)
Journal Volume
34
Journal Issue
1
Journal Page Range
p. 399-403
ISSN
1742-6596

Conference

Title
International MEMS conference 2006
Acronym
iMEMS2006
Dates
9-12 May 2006
Place
Singapore (Singapore)

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37058535
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
FABRICATION; HARDNESS; MACHINING; POLYCHLORINATED BIPHENYLS; ROBOTS; SEMICONDUCTOR MATERIALS; SHEAR; SILICON; SLIP; STRAIN GAGES
Descriptors DEC
AROMATICS; CHLORINATED AROMATIC HYDROCARBONS; ELEMENTS; EQUIPMENT; HALOGENATED AROMATIC HYDROCARBONS; MATERIALS; MEASURING INSTRUMENTS; MECHANICAL PROPERTIES; ORGANIC CHLORINE COMPOUNDS; ORGANIC COMPOUNDS; ORGANIC HALOGEN COMPOUNDS; SEMIMETALS