Published February 28, 2019 | Version v1
Journal article

Optimizing reaction kinetics of sequential deposition technique for ambient air and solution processed hybrid perovskite thin films

  • 1. National University of Sciences and Technology, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME) (Pakistan)
  • 2. International Islamic University, Centre for Advanced Electronics and Photovoltaic Engineering (CAEPE) (Pakistan)

Description

In this work, the reaction kinetics of sequential deposition technique were optimized to produce large area (~ 1 cm2), uniform and pinhole free hybrid CH3NH3PbI3 perovskite (MAPbI) thin films in ambient air; at room temperature and a relatively high humidity level of ~ 50%. The MAPbI thin films were grown upon a thin passivation layer of CH3NH3I (MAI) using conventional two step deposition scheme. The films were characterized using Scanning Electron Microscope (SEM), X-ray diffraction (XRD), Electroimpedance Spectroscopy, Current–Voltage and DC-Hall effect measurements. The resultant MAPbI thin films demonstrated negligible amount of unreacted PbI2 because of the sandwich structure where PbI2 layer was embedded in-between two MAI layers. Thin films showed a decreased resistance (~ 14 MΩ), increased intrinsic charge carrier concentration (~ 9.3 × 1015 cm−3) and higher charge carrier mobilities (~ 195 cm2 V−1s−1). The decrease in resistance and increase in charge carrier mobilities were attributed to the reduced trap sites and grain boundaries in MAPbI thin film front face due to the MAI passivation layer. The increase in charge carrier density was a consequence of MAI passivation layer on the energy levels tuning of MAPbI. The MAPbI thin films also showed promising stability of above 70%; after 8 weeks of ambient air storage and without any encapsulation.

Additional details

Identifiers

Publishing Information

Journal Title
Journal of Materials Science. Materials in Electronics
Journal Volume
30
Journal Issue
4
Journal Page Range
p. 4250-4258
ISSN
0957-4522
CODEN
JSMEEV

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