Published January 15, 2008 | Version v1
Journal article

Growth of GaN on SiC/Si substrates using AlN buffer layer by hot-mesh CVD

  • 1. Nagaoka University of Technology, Nagaoka 940-2188 (Japan)
  • 2. Center of Interdisciplinary Research, Tohoku University, Sendai 980-8578 (Japan)
  • 3. Research Institute of Electrical Communication, Tohoku University, Sendai 980-8577 (Japan)
  • 4. Faculty of Science and Technology, Hirosaki University, Hirosaki 036-8561 (Japan)

Description

GaN films were grown on SiC/Si (111) substrates by hot-mesh chemical vapor deposition (CVD) using ammonia (NH3) and trimetylgallium (TMG) under low V/III source gas ratio (NH3/TMG = 80). The SiC layer was grown by a carbonization process on the Si substrates using propane (C3H8). The AlN layer was deposited as a buffer layer using NH3 and trimetylaluminum (TMA). GaN films were formed and grown by the reaction between NHx radicals, generated on a tungsten hot mesh, and the TMG molecules. The GaN films with the AlN buffer layer showed better crystallinity and stronger near-band-edge emission compared to those without the AlN layer

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2007.06.200

Additional details

Identifiers

DOI
10.1016/j.tsf.2007.06.200;
PII
S0040-6090(07)00961-3;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
516
Journal Issue
5
Journal Page Range
p. 659-662
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
4. international conference on hot-wire CVD Cat-CVD process
Dates
3-8 Oct 2006
Place
Takayama, Gifu (Japan)

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.