Published January 15, 2012 | Version v1
Journal article

Effect of Cu addition on microstructure and corrosion behavior of spray-deposited Zn–30Al alloy

  • 1. State Key Laboratory for Nonferrous Metals and Process, General Research Institute for Nonferrous Metals Beijing, Beijing 100088 (China)

Description

Highlights: ► Zn–30Al–xCu alloys were synthesized by the spray atomization and deposition technique. ► Immersion test and electrochemical measurements have been used to estimate the corrosion rate and the behavior. ► The result indicates that the 1 wt.% Cu addition displays superior corrosion resistance. - Abstract: In this study, one binary Zn–30Al and three ternary Zn–30Al–Cu alloys were synthesized by the spray atomization and deposition technique. The microstructures of the spray-deposited alloys were investigated by means of scanning electron microscope (SEM), transmission electron microscope (TEM), X-ray diffraction (XRD). Immersion test, potentiodynamic polarization and electrochemical impedance measurements have been used to estimate the corrosion rate and the behavior. The results indicate that the 1 wt.% Cu addition to spray-deposited Zn–30Al alloy does not make significant change in microstructure. However, with the 2, 4 wt.% Cu additions to the alloy, some ε-CuZn4 compounds with particle or irregular shapes were observed on the grain boundaries in the microstructures. Immersion test and electrochemical measurements confirmed that the 1 wt.% Cu addition displays superior corrosion resistance, whereas the 2, 4 wt.% Cu additions have a baneful effect on the corrosion behavior.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2011.10.069

Additional details

Identifiers

DOI
10.1016/j.msea.2011.10.069;
PII
S0921-5093(11)01171-3;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
532
Journal Page Range
p. 100-105
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.