Published 1987 | Version v1
Book

Blanket tungsten film formation by photo-enhanced and plasma-enhanced chemical vapor deposition

  • 1. Production Engineering Research Lab., Hitachi, Ltd., Totsuka-ku, Yokohama 244 (Japan)

Description

Tungsten films have been deposited on SiO2 in WF6-H2 CVD system using A/sub r/F excimer laser radiation or hydrogen micro wave plasma. for these W films, conformal coverage over SiO2 steps on a Si substrate has been achieved. Resistivities of these W films range from 8 to 12 μΩ-cm, which are as low as those of W films deposited by thermal CVD. The activation energy of film formation was estimated to be 35 kJmol for photo-enhanced CVD and 39 kJmol for plasma-enhanced CVD. The kinetic data obtained suggests that the surface diffusion of hydrogen atoms is the deposition rate-limiting process and hydrogen atoms produced in the gas phase play a role for blanket deposition of tungsten films in the photo-enhanced CVD and plasma-enhanced CVD

Additional details

Publishing Information

Publisher
The Electrochemical Society.
Imprint Place
Pennington, NJ (USA)
Imprint Title
Multilevel metallization, interconnection, and contact technologies
Journal Page Range
p. 24-31.

Conference

Title
Multilevel metallization, interconnection, and contact technologies.
Dates
19-24 Oct 1986.
Place
Boston, MA (USA).