Addition of silver in copper nitride films deposited by reactive magnetron sputtering

Silver-copper nitride thin films were deposited on glass substrates by reactive co-sputtering of silver and copper targets. The films were characterized by energy dispersive X-ray spectroscopy to determine the silver to copper atomic ratio and by X-ray diffraction to determine the film structure. From the experimental values of lattice constant and UV-visible reflectance measurements, the position of silver atoms in Cu3N films was discussed. Finally, the effect of silver on the film electrical resistivity was presented