Published January 17, 2011 | Version v1
Journal article

Material Behavior At The Extreme Cutting Edge In Bandsawing

  • 1. School of Computing Engineering and Information Sciences, Ellison Building, Northumbria University, Newcastle Upon Tyne, NE1 8ST (United Kingdom)
  • 2. R and D Saws, SNA Europe, Fiskaregatan 1, Lidkoeping (Sweden)

Description

In recent years, bandsawing has been widely accepted as a favourite option for metal cutting off operations where the accuracy of cut, good surface finish, low kerf loss, long tool life and high material removal rate are required. Material removal by multipoint cutting tools such as bandsaw is a complex mechanism owing to the geometry of the bandsaw tooth (e.g., limited gullet size, tooth setting etc.) and the layer of material removed or undeformed chip thickness or depth of cut (5 μm-50 μm) being smaller than or equal to the cutting edge radius (5 μm-15 μm). This situation can lead to inefficient material removal in bandsawing. Most of the research work are concentrated on the mechanics of material removal by single point cutting tool such as lathe tool. However, such efforts are very limited in multipoint cutting tools such as in bandsaw. This paper presents the fundamental understanding of the material behaviour at the extreme cutting edge of bandsaw tooth, which would help in designing and manufacturing of blades with higher cutting performance and life. ''High Speed Photography'' has been carried out to analyse the material removal process at the extreme cutting edge of bandsaw tooth. Geometric model of chip formation mechanisms based on the evidences found during ''High Speed Photography'' and ''Quick Stop'' process is presented. Wear modes and mechanism in bimetal and carbide tipped bandsaw teeth are also presented.

Additional details

Identifiers

Publishing Information

Journal Title
AIP Conference Proceedings
Journal Volume
1315
Journal Issue
1
Journal Page Range
p. 1059-1061
ISSN
0094-243X
CODEN
APCPCS

Conference

Title
International conference on advances in materials and processing technologies
Acronym
AMPT2010
Dates
24-27 Oct 2010
Place
Paris (France)

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
42104654
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ACCURACY; BIMETALS; CARBIDES; CUTTING TOOLS; LAYERS; LOSSES; MANUFACTURING; PHOTOGRAPHY; REMOVAL; SURFACES; THICKNESS; VELOCITY
Descriptors DEC
CARBON COMPOUNDS; DIMENSIONS; EQUIPMENT; TOOLS

Optional Information

Notes
(c) 2010 American Institute of Physics