Fabrication of mm-wave undulator cavities using deep x-ray lithography

The possibility of fabricating mm-wave radio frequency cavities (100 endash 300 GHz) using deep x-ray lithography (DXRL) is being investigated. The fabrication process includes manufacture of precision x-ray masks, exposure of positive resist by x-ray through the mask, resist development, and electroforming of the final microstructure. Highly precise, two-dimensional features can be machined onto wafers using DXRL. Major challenges are: fabrication of the wafers into three-dimensional rf structures; alignment and overlay accuracy of structures; adhesion of the PMMA on the copper substrate; and selection of a developer to obtain high resolution. Rectangular cavity geometry is best suited to this fabrication technique. A 30- or 84-cell 108-GHz mm-wave structure can serve as an electromagnetic undulator. A mm-wave undulator, which will be discussed later, may have special features compared to the conventional undulator. First harmonic undulator radiation at 5.2 keV would be possible using the Advanced Photon Source (APS) linac system, which provides a low-emittance electron beam by using an rf thermionic gun with an energy as high as 750 MeV. More detailed rf simulation, heat extraction analysis, beam dynamics using a mm-wave structure, and measurements on 10x larger scale models can be found in these proceedings [Y.W. Kang et al., open-quote open-quote Design and Construction of Planar mm-wave Accelerating Cavity Structures close-quote close-quote] copyright 1996 American Institute of Physics