Published January 15, 2016 | Version v1
Journal article

Control of the in-plane thermal conductivity of ultra-thin nanocrystalline diamond films through the grain and grain boundary properties

  • 1. Center for Device Thermography and Reliability, University of Bristol (United Kingdom)
  • 2. Institute of Electron Devices and Circuits (EBS), Ulm University, Ulm (Germany)
  • 3. Centre for Energy Research, Institute for Technical Physics and Materials Science, Budapest (Hungary)
  • 4. Naval Research Laboratory, Washington, DC 20375 (United States)

Description

The in-plane thermal conductivity of polycrystalline diamond near its nucleation site, which is a key parameter to an efficient integration of diamond in modern high power AlGaN/GaN high electron mobility devices, has been studied. By controlling the lateral grain size evolution through the diamond growth conditions it has been possible to increase the in-plane thermal conductivity of the polycrystalline diamond film for a given thickness. Besides, the in-plane thermal conductivity has been found strongly inhomogeneous across the diamond films, being also possible to control this inhomogeneity by the growth conditions. The experimental results has been explained through a combined effect of the phonon mean free path confinement due the grain size and the quality of the grain/grain interfaces, showing that both effects evolve with the grain expansion and are dependant on the diamond growth conditions. This analysis shows how the thermal transport in the near nucleation region of polycrystalline diamond can be controlled, which ultimately opens the door to create ultra-thin layers with a engineered thermal conductivity, ranging from a few W/m K to a few hundreds of W/m K.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.actamat.2015.09.045

Additional details

Identifiers

DOI
10.1016/j.actamat.2015.09.045;
PII
S1359-6454(15)00734-X;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
103
Journal Page Range
p. 141-152
ISSN
1359-6454
CODEN
ACMAFD

Optional Information

Copyright
Copyright (c) 2015 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.