Published October 26, 2006 | Version v1
Journal article

Low temperature specific heat and thermoelectric power of UCu3M2Al7 alloys

  • 1. Polish Academy of Sciences, W. Trzebiatowski Institute of Low Temperature and Structure Research, P.O. Box 1410, 50-950 Wroclaw 2 (Poland) and International Laboratory of High Magnetic Fields and Low Temperatures, P.O. Box 4714, 50-985 Wroclaw 47 (Poland)
  • 2. Polish Academy of Sciences, W. Trzebiatowski Institute of Low Temperature and Structure Research, P.O. Box 1410, 50-950 Wroclaw 2 (Poland)

Description

The specific heat and thermoelectric power of the UCu3M2Al7 alloys where M = Cr, Mn and Fe are presented. The specific heat has been measured in the temperature range 2.6-70 K in magnetic field H = 0 and 3 T using a homemade and full automatic calorimeter, whereas the thermoelectric power has been measured from 6 to 300 K employing a differential method with copper as reference material. The temperature dependence of the specific heat exhibits only a minute influence of magnetic field and no anomaly in the investigated temperature region. However, the coefficients of the electronic specific heat of all alloys are very close, being enhanced amount to about 200 mJ mol-1 K-2 at high temperature and to about 400 mJ mol-1 K-2 at low temperature. Strongly correlated electrons or crystallographic disorder are considered as a reason for these values. The thermoelectric power demonstrates moderate values within whole investigated temperature range

Additional details

Identifiers

DOI
10.1016/j.jallcom.2005.12.049;
PII
S0925-8388(05)01926-2;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
423
Journal Issue
1-2
Journal Page Range
p. 37-39
ISSN
0925-8388
CODEN
JALCEU

Conference

Title
Symposium B, Multi-component alloys and intermetallic compounds for magnetic applications and nanotechnology; E-MRS 2005: Symposium D, magnetoelectronics
Acronym
E-MRS 2005
Dates
5-9 Sep 2005
Place
Warsaw (Poland)

Optional Information

Copyright
Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.