Published March 8, 2001
| Version v1
Report
Development of a high density pixel multichip module at Fermilab
Description
At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization
Availability note (English)
Available from PURL: https://www.osti.gov/servlets/purl/775508-2Kjj0q/native/Additional details
Identifiers
Publishing Information
- Imprint Pagination
- 859 Kilobytes
- Report number
- FERMILAB-Conf--01/016-E
Conference
- Title
- 51. Electronic Components and Technology Conference
- Dates
- 29 May - 1 Jun 2001
- Place
- Lake Buena Vista, FL (United States)
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 32014755
- Subject category
- S43: PARTICLE ACCELERATORS;
- Resource subtype / Literary indicator
- Conference, Non-conventional Literature
- Descriptors DEI
- ACCELERATOR FACILITIES; DATA ACQUISITION SYSTEMS; DESIGN; FABRICATION; FLEXIBILITY; INTEGRATED CIRCUITS; PERFORMANCE
- Descriptors DEC
- ELECTRONIC CIRCUITS; MECHANICAL PROPERTIES; MICROELECTRONIC CIRCUITS; TENSILE PROPERTIES
Optional Information
- Contract/Grant/Project number
- AC02-76CH03000
- Funding organization
- USDOE Office of Energy Research (ER) (United States)