Published March 8, 2001 | Version v1
Report

Development of a high density pixel multichip module at Fermilab

Description

At Fermilab, both pixel detector multichip module and sensor hybridization are being developed for the BTeV experiment. The BTeV pixel detector is based on a design relying on a hybrid approach. With this approach, the readout chip and the sensor array are developed separately and the detector is constructed by flip-chip mating the two together. This method offers maximum flexibility in the development process, choice of fabrication technologies, and the choice of sensor material. This paper presents strategies to handle the required data rate and performance results of the first prototype and detector hybridization

Availability note (English)

Available from PURL: https://www.osti.gov/servlets/purl/775508-2Kjj0q/native/

Additional details

Publishing Information

Imprint Pagination
859 Kilobytes
Report number
FERMILAB-Conf--01/016-E

Conference

Title
51. Electronic Components and Technology Conference
Dates
29 May - 1 Jun 2001
Place
Lake Buena Vista, FL (United States)

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
32014755
Subject category
S43: PARTICLE ACCELERATORS;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
ACCELERATOR FACILITIES; DATA ACQUISITION SYSTEMS; DESIGN; FABRICATION; FLEXIBILITY; INTEGRATED CIRCUITS; PERFORMANCE
Descriptors DEC
ELECTRONIC CIRCUITS; MECHANICAL PROPERTIES; MICROELECTRONIC CIRCUITS; TENSILE PROPERTIES

Optional Information

Contract/Grant/Project number
AC02-76CH03000
Funding organization
USDOE Office of Energy Research (ER) (United States)