Published June 30, 2003 | Version v1
Journal article

Microscopic mechanism of interfacial reaction during Si oxidation

Description

The reaction of atomic oxygen at the SiO2/Si(1 0 0) interface is studied based on total-energy electronic-structure calculations. It is found that the reaction in which an O atom in the oxide inserts into the Si-Si bond of the substrate is largely exothermic. The calculated energy barrier of 0.87 eV for this reaction is lower than the experimentally reported activation energy (2.0 eV) for the interfacial reaction in the dry oxidation. The results would help us clarify the microscopic mechanism of Si oxidation, especially in identifying the form of oxidant in the dry oxidation

Additional details

Identifiers

DOI
10.1016/S0169-4332(03)00381-7;
arXiv
arXiv:hep-ph/9602243v1;
PII
S0169433203003817;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
216
Journal Issue
1-4
Journal Page Range
p. 270-274
ISSN
0169-4332
CODEN
ASUSEE

Conference

Title
4. international symposium on the control of semiconductor interfaces
Dates
21-25 Oct 2002
Place
Karuizawa (Japan)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38086754
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ACTIVATION ENERGY; ELECTRONIC STRUCTURE; EV RANGE 01-10; INTERFACES; OXIDATION; OXIDIZERS; OXYGEN; SILICON; SILICON OXIDES
Descriptors DEC
CHALCOGENIDES; CHEMICAL REACTIONS; ELEMENTS; ENERGY; ENERGY RANGE; EV RANGE; NONMETALS; OXIDES; OXYGEN COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.