Published March 8, 2005 | Version v1
Journal article

Formation and morphology of the intermetallic compounds formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface

  • 1. Department of Materials Science and Engineering, National United University, 1 Lien-Da, Kung-Ching Li, Miao-Li 36003, Taiwan (China) and Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, 415 Chien-Kung Road, Kaohsiung 80782, Taiwan (China)
  • 2. Department of Materials Science and Engineering, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan 70101, Taiwan (China)

Description

Formation and morphology of the intermetallic compounds (IMCs) formed at the 91Sn-8.55Zn-0.45Al lead-free solder alloy/Cu interface has been studied using X-ray diffraction (XRD), scanning electron microscopy (SEM), transmission electron microscopy (TEM) and electron diffraction (ED). The XRD analysis indicates that the γ-Cu5Zn8 IMC is found at the solder/Cu interface in the as-wetted sample. When heat treated at 423 K for 100 or 400 h, the IMC phases still remain as γ-Cu5Zn8 and Cu6Sn5. As the aging time increases from 400 to 1000 h, besides γ-Cu5Zn8 and Cu6Sn5, γ'-Cu9Al4 also appears. Planar-shaped γ-Cu5Zn8 and Cu6Sn5 are found near the solder and the Cu substrate, respectively. However, scallop-shaped γ-Cu5Zn8 is found at the eutectic 91Sn-8.55Zn-0.45Al solder alloy/Cu interface when aged at 423 K

Additional details

Identifiers

DOI
10.1016/j.jallcom.2004.08.009;
PII
S0925-8388(04)01014-X;

Publishing Information

Journal Title
Journal of Alloys and Compounds
Journal Volume
389
Journal Issue
1-2
Journal Page Range
p. 133-139
ISSN
0925-8388
CODEN
JALCEU

Optional Information

Copyright
Copyright (c) 2004 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.