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[en] For technical development, it is the prerequisite to clarify the terms to be used in various fields and their definition, therefore, in various foreign countries, there are some standards on terms in respective fields, and also as international standards, ISO/TC 135 (Non-destructive testing) organized the SC on terms from the beginning of foundation. In JIS, there is the column for corresponding English (for reference), but there is the problem of English and American English. The English used in ISO, BS or EN and ASTM standards in relation to nondestructive testing were collected in every technical field and put in order, and the corresponding English terms were selected. Moreover at this opportunity, the terms having the definition in these international, national and semi-national standards were classified into eight fields, that is, common (approval, quality assurance, defects and others), radiography, ultrasonic flaw detection, acoustic emission, eddy current flaw detection, magnetic flaw detection, liquid penetrant testing and leak test, and the Japanese translation was stipulated. The draft of this standard was approved by the standardization committee on January 17, 1991. (K.I.)

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[en] This paper describes methods for generating artificial motion applicable to seismic design analyses and vibration tests of plant equipment to prove seismic performance. A typical motion that satisfies the target response spectrum (TRS) is used as the input motion of the vibration test. The TRS is generally produced by enveloping various floor response spectra of the tested equipment so that the spectrum tends to have wide-band frequency components (WBFCs) reflecting various plant conditions. The WBFCs generally increase the maximum acceleration of the generated motion. Moreover, there are limits to shaking table performance, including applicable maximum acceleration, velocity, and displacement. These limits sometimes cause problems in generating the motion. This paper reviews some typical methods of generating artificial earthquake motion and their improvement to generate motion satisfying the WBFC spectrum for lightly damped equipment. Typical motions generated by the improved method have never been generated previously by conventional methods of generating artificial earthquakes. (author)

[en] Reflecting recent developments in computer and image processing technology, some X-ray nondestructive testing (NDT) now use digital image processing, which has dramatically improved the sensitivity of the X-ray TV system. This allows inspection of semiconductors and printed circuit boards with accuracy in the tens of micron range. Automatic high-speed determination of foreign matter contained in a sample is also possible. Industrial CT scanners are now capable of generating tomograms of defects as small as several tens of microns and three-dimensional inspection of samples. (author)

[en] In non-destructive tests, the results of flaw detection are apt to be affected by the sources of emission, sensors, test specimens and environmental conditions. Therefore, defects are sometimes overlooked, and defect-like indications are given despite there is no defect. In order to improve such conditions, there are two most basic and important problems, namely the dimensions and forms of the objects to be tested and the determination of flaw-detecting conditions. In order to obtain the optimum testing conditions, the forms of the objects to be tested must be as simple as possible. In case of welding design, fillet welding must be avoided in important places. Simple forms contribute to the improvement of reliability and the reduction of cost of products. In case of applying non-destructive tests to complex forms, it must be confirmed beforehand that sufficiently satisfactory results can be obtained by the planned method. Such test has been already taken up in ASME Code, Sec. 5. The items which are required to be included in the test procedure manuals for non-destructive tests in the ASME Code, Sec. 5 are shown. Such items of radiographic test, ultra-sonic flaw detection, magnetic particle flaw detection and penetrant flaw detection are explained. The techniques demonstrated should be the same as the actual flaw detection techniques. (Kako, I.)