[en] This scientific study focuses on the investigation of the cutting forces developed during dry longitudinal turning with TiAlN PVD coated inserts of a CoCrWNi alloy used in medical applications, especially in orthopaedics. The present paper is organised in two main parts: the first part presents the experimental procedure in terms of material, input data, necessary technological means, physical experiments and data registration while the second part presents the results and their subsequent interpretation. The study reveals the variation of the turning cutting forces in relation to the cutting regime parameters. (paper)

[en] Previous work on ultra-thin P(VDF-TrFE) Langmuir-Blodgett films has indicated a transition from extrinsic to intrinsic ferroelectric switching. The lack of several key features of intrinsic switching in the experimental work reported by Kliem et al argues against intrinsic switching. In this Comment we discuss two published papers and new experimental results that support a lack of intrinsic switching and point to the conclusion that the thickness dependence of the Langmuir-Blodgett films is due to the influence of the electrode interfaces. (comment)

No abstract available

[en] Current-perpendicular-to the plane (CPP) giant magnetoresistive (GMR) sensors with a current-confined-path (CCP) layer inserted within the Cu spacer have been manufactured using ultrahigh vacuum PVD sputtering, photolithography, and ion milling processes. Compared with a pure metallic CPP system, the CCP insertion layer enables a substantial increase in sensor resistance with an equivalent or better GMR ratio, and thus a significant improvement in the ΔRA amplitude. Heads with such a sensor have been tested under various bias currents, both quasistatically and on a spinstand. It was found that the resistance of the sensors increases with increasing bias current and voltage, following typical metallic behavior. Also, the CCP insertion layer enables operation at higher bias currents compared with the pure metallic sensors (without the insertion layer) and thus a higher output signal. This effect is attributed to less magnetic instability due to the reduced Ampere fields around the narrow (∼6 nm) current-confined paths. Finally, the CPP-GMR heads with CCP layer were tested under high-density recording conditions using the perpendicular recording media. Bit error rate (BER) as a function of linear density is reported. Microtrack profiles were also recorded to determine track density capability.

[en] Physical vapor deposition of Si onto transferred graphene is investigated. At elevated temperatures, Si nucleates preferably on wrinkles and multilayer graphene islands. In some cases, however, Si can be quasi-selectively grown only on the monolayer graphene regions while the multilayer islands remain uncovered. Experimental insights and ab initio calculations show that variations in the removal efficiency of carbon residuals after the transfer process can be responsible for this behavior. Low-temperature Si seed layer results in improved wetting and enables homogeneous growth. This is an important step towards realization of electronic devices in which graphene is embedded between two Si layers

[en] Electrochemical s techniques were used to study the corrosion behaviour of Tin films on commercial Ti and Zircaloy-4 substrates. Using a Nissin RMP3-R3-J equipment lims of 4μ were obtained via PVD. The tests performed at room temperature, in 0.1 MNACl solution, were the following: Potentiodynamic Polarization curves (scan rate= 0.1666 mV/s) Galvanostatic tests ( i=0.8 mA/cm²). The results were compared with the results of the tests applied to bare substrates under the same experimental conditions. In another set of tests the electronic properties of the film layer were determined via anodic and cathodic polarization curves in a solution containing a redox couple ( Na₂So₄ 0,1M+K₄[Fe(CN)₆]0,05M+K₃[Fe(CN)₆] 0,05M). The polarization curves showed that- in principle- The layer did not affect the anodic behaviour of both substrates under these experimental corrosion conditions. Nevertheless, for low over potentials, the anodic current density is lower for the material with the protective layer. Besides, the tests performed with the redox couple [Fe(CN)₆]^-4/[Fe(CN)₆]^-3 indicated that the conductivity of the Tin film is higher than the surface films present on the Ti an Zry-4 (JCH)

[en] Reactive magnetron sputtering, a physical vapor deposition (PVD) technique, is used widely for deposition of compound and composite coatings. Ternary compound or multi component compound coatings are increasingly being researched due to their exotic properties. The properties of these coatings depend strongly on the composition of the films. A mathematical model has been developed to predict the composition of the metallic constituents of the coatings deposited by reactive magnetron sputtering using two metals composite target in the presence of a reactive gas (nitrogen) environment. In the model, composition of the metallic constituents of the coating and percentage of covered areas of the target (target poisoning) vis-a-vis partial pressure of nitrogen can be predicted. The model has been experimentally tested on titanium-niobium system. (author)

[en] In this study, TiN is coated on copper surface by Arc-PVD (Physical Vapour Deposition) at different thickness, then resistivity of samples is investigated. In metal film coating on metal surface technique, thickness of coating is measurable experimentally by investigating current voltage variation is shown

[en] The design of a deposition system with a plasma source having a hollow cathode with an insert is given. The source has the advantage of a uniform discharge and evaporation rate

No abstract available