[en] The stabilization of niobium-tin Nb₃Sn superconducting foils with copper is carried out by deposition or by diffusion in pure copper or in a tin bath containing different copper levels, with the surface etched or unetched. The foils are covered with a copper film at a temperature of 300 to 5O0 degC using a tin solder, spread on a copper, silver or nickel layer deposited on the foil surface from solutions for electroless plating. The bond between the surface of the superconducting foil and the electroless plated metal layer is annealed in a controlled atmosphere or in a vacuum at a temperature of 200 to 500 degC for over 20 to 60 minutes. The copper stabilization layer can also be produced electrolytically. (J.B.)