[en] The claim of the patent is a method consisting in the etching of the remnant of tin or bronze with HCl or a solution of HCl and HNO³ or another suitable etching agent after the end of the diffusion process. Then the strip is copper coated in an alkaline solution containing Seignette salt, NaOH and CuSO⁴ with a layer of copper 1 μm thick. On this layer is electrolytically plated the stabilizing copper in an acid copper-plating solution. This method makes it possible to obtain a contact resistance between the superconducting material and the copper stabilizing layer as low as 6 to 8x10^-₉ Ohm.cm^-₂ and to increase the mechanical cohesion of the superconducting material and the stabilizing layer. (Ha)