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Salerno, L.J.; Kittel, P.; Spivak, A.L.
National Aeronautics and Space Administration, Moffett Field, CA (USA). Ames Research Center1983
National Aeronautics and Space Administration, Moffett Field, CA (USA). Ames Research Center1983
AbstractAbstract
[en] The thermal contact conductance of a 0.4 micrometer surface finish OFHC copper sample pair has been investigated from 1.6 to 3.8 K for a range of applied contact forces up to 670 N. Experimental data have been fitted to the relation for the integral alpha T to the nth power dt by assuming that the thermal contact conductance is a simple power function of the sample temperature. It has been found that the conductance is proportional to T squared and that conductance increases with an increase in applied contact force. These results confirm earlier work
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May 1983; 8 p; NASA-TM--84365; Available from NTIS, PC A02/MF A01
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