[en] A new electrolyte to deposite coatings of nickel-tungsten alloy is produced. To increase microhardness of the coatings at the expense of tungsten content increase it contains additionally potassium iodide, and as a salt of tungstic acid-ammonium tungstate. The invention can be used when manufacturing strain-resistant, threshold strain-resistant, impulse, mixing and SHF-diodes on the basis of silicon. It is shown, that the electrolyte suggested permitted to achieve a two-time increase in the coating microhardness at the expense of tungstent increase in the coating