[en] Plain creep (PC) and creep crack growth (CCG) tests at 360 deg C and post metallography were carried out on a low alloy reactor pressure vessel steel (ASTM A508 class 2) with different microstructures. Lives for the CCG tests were shorter than those for the PC tests and this is more pronounced for simulated heat affected zone microstructure than for the parent metal at longer lives. For the CCG tests, after initiation, the cracks grew constantly and intergranularly before they accelerated to approach rupture. The creep crack growth rate is well described by C*. The relations between reference stress, failure time and steady crack growth rate are presented for the CCG tests. It is demonstrated that the failure stress due to CCG is considerably lower than the yield stress at 360 deg C. Consequently, the CCG will control the static strength of a reactor vessel