[en] The aim of the research was to electrodeposit the Co-W alloy containing 46-50 wt% W and to determine the structural and phase stability of electrodeposited and chemically deposited gold layers, if the electrodeposited Co-W amorphous alloy containing approximately 50 wt% W was used as a barrier layer on a copper substance. The changes in the structure and phase composition of the electrodeposited Co-W amorphous alloy, the electrodeposited and chemically deposited gold layers in the systems Co-W/Cu, Au (electrodeposited)/Co-W/Cu, Au (chemically deposited)/Co-W/Cu at thermal treatment were studied using X-ray diffraction, transmission electron microscopy and scanning electron microscopy. The results obtained demonstrate the stability of phase composition and structure of the electrodeposited (thickness 1.0-1.7 μm) and, in spite of changes in the structure, good adhesion of chemically deposited (thickness 0.4-0.8 μm) Au layer in the systems Au/Co-W(W48-52 wt%)/Cu