[en] This study uses molecular dynamics to simulate the nanoscale cutting of a Cu single crystal by a conical diamond tool. Actual nanoscale straight-line cutting experiments were performed, and the experimental results are compared with the simulation results. The heaping of copper atoms is qualitatively quite consistent with the simulation result. This paper also proposes a nanoscale contact pressure factor (NCP factor) that is applicable to the probes at different tip radii. An estimation model of the cutting force for nanoscale cutting is established. This model can estimate the cutting force during actual nanoscale cutting. Actual nanoscale cutting experiments were performed for verification, and the difference between the cutting force estimated by this model and the actual force is very small