[en] The ternary Sn-Cu-Co system eutectic composition was obtained by means of CALPHAD (CALculation of PHAse Diagram) methodology and it was found to be 0.4% Co and 0.7% Cu (wt%) with a melting point of 224 deg. C. The tensile behavior of this alloy was investigated at different strain rates (10^-5, 10^-4 and 10^-3 s^-1) and compared to both Sn-37Pb and Sn-4.0Ag-0.5Cu. The Sn-4.0Ag-0.5Cu alloy depicts the highest ultimate tensile strength (UTS) followed by the Sn-37P and finally the Sn-0.7Cu-0.4Co system. The elastic modulus was also higher for the Sn-4.0Ag-0.5Cu followed by the Sn-0.7Cu-0.4Co and last the Sn-37Pb. The microstructure of the Sn-0.7Cu-0.4Co alloy is composed of two types of intermetallic phases, (Cu,Co)₆Sn₅ and (Co,Cu)Sn₂ dispersed in a Sn-rich matrix. The microstructure of this alloy proved to be very stable, after aging at 150 ^oC for 24 h. The eutectic Sn-0.7Cu-0.4Co solder alloy can therefore be a very good alternative for the SAC alloys for surface mount technology applications