[en] 300 keV C⁺ ion implantation onto Si(1 0 0) wafers was carried out at temperatures of 400, 500, 550, 600, 650 and 700 deg. C. Depth profile of C was determined by resonant Rutherford backscattering spectrometry (RRBS) measurements using ¹²C(α,α)¹²C resonant reaction with the α-particle energy of 4.27 MeV. The concentration of the implanted carbon at the surface as a function of inverse of implantation temperature shows an Arrhenius behaviour. The activation energy for diffusion of carbon in Si was measured and found to be 0.434 eV, which is smaller than the activation energy (0.88 eV) for the C diffusion in Si in equilibrium condition. The possible mechanism of C diffusion in Si during irradiation conditions existing in our experiments where large concentration of vacancies and interstitials are produced is discussed and we find that the C diffusion during irradiation conditions could be due to the drag the carbon towards the surface by the vacancy flux