[en] Thermal analysis was carried out on 1 mm tungsten coated CuCrZr alloy heat sink using ANSYS code under the steady state heat flux of 5 MW/m². The effect on the stress, strain and surface temperature of using Titanium, nickel-chromium-aluminum alloys and W/Cu mixtures materials as compliant interlayers is examined and compared to the sharp interface architecture. Interlayer architectures effectively alleviated stress concentration in the interface compared to the sharp interface though surface temperature was increased slightly. W/Cu interlayer resulted in the maximum stress reduction of 23%, and surface temperature was only 11.8 deg. C higher than that of the sharp interface. Optimization of W/Cu interlayer observed that for 1 mm W coating 0.1 mm W/Cu interlayer with 25 vol.% W was the optimum interlayer, which resulted in the smallest peak stress