[en] Electron probe microanalysis and focussed ion beam milling are combined to improve the sensitivity and applicability of depth profiling quantification. With the nanoscale milling capabilities of the ion beam, very shallow bevels are milled by using a special preparation procedure to reduce any curtaining effect and minimize Ga ions implantation. A Ni/Cr multilayered specimen is used to evaluate the depth resolution. The best results are obtained by a well-focussed electron beam offered by a field-emission microprobe. A new evaluation algorithm is presented to quantify the structure in terms of mass thicknesses or if the density is known in terms of real thicknesses. The quantification procedure is based on Monte Carlo simulations where calculated k-ratios (calibrated X-ray intensities) are compared to the experimental ones to find the optimal structure. In comparison with an ion milled cross-section, the proposed bevel technique is more sensitive and provides more information about the material's structure. (paper)