[en] The successful fabrication of high-performance flexible thin film solar cells (TFSCs) directly on diverse substrates is intrinsically limited by the processing temperature and substrate property. In this work, a colloidal transfer-printing (CTP) method is developed to fabricate large-area flexible thin-film absorbers with an antireflection coating and periodic configurations. Compared with a planar film, such structures exhibit much lower reflectance due to the antireflection introduced by the textured polydimethylsiloxane and the enhanced scattering introduced by the periodic back-scattering reflector. Optical simulation using the finite-element method indicates the structural periodicity for maximum light absorption is of 300 nm for an ultrathin amorphous silicon (a-Si) film with a thickness of 160 nm. The patterned a-Si film yields an overall absorption of 64.8%, which is much larger than the planar counterpart of 38.5%. This new approach to thin-film transfer can be readily extended to other material systems and device structures, opening up an effective alternative to traditional fabrication of the low-cost and high-performance optoelectronic devices. (paper)