[en] In this paper we develop an array of pressure control units that locally and selectively pressurizes the wafer for better uniformity of thickness removal during the chemical mechanical planarization (CMP) process. A real-time metrology measurement determines where on the wafer the microactuator array should be activated in order to improve the overall uniformity of the wafer surface. We developed a new micro surface actuation mechanism comprising an array of piezoelectric bending discs sandwiched in a single multi-layer package. We obtained scalable manufacturing and packaging methods that do not only reduce the mechanical misalignment tolerances of such arrays, but also improve their electrical interconnect reliability under harsh environments. The finite element models showed that an individual disc in the array can generate local contact pressure. CMP experiments showed that such locality controlled the material removal rate on silicon wafer. A microactuator unit in an array delivered precise displacement and large pressure outputs measured for a wide range of input voltages. The static and dynamic responses of the microactuator were linear, and had a fast response to voltage input, making it suitable for high speed distributed pressure compensation during the CMP process. (paper)